Hisao Nishimura
Vorsitzender bei Bandick Corp.
Profil
Hisao Nishimura is currently the Chairman at Bandick Corp.
He previously worked as the Representative Director at Towa Corp.
from 2012 to 2013 and as a Manager at The Bank of Kyoto, Ltd.
Aktive Positionen von Hisao Nishimura
Unternehmen | Position | Beginn |
---|---|---|
Bandick Corp.
Bandick Corp. Miscellaneous ManufacturingProducer Manufacturing Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life. | Vorsitzender | 01.04.2012 |
Ehemalige bekannte Positionen von Hisao Nishimura
Unternehmen | Position | Ende |
---|---|---|
The Bank of Kyoto, Ltd.
The Bank of Kyoto, Ltd. Major BanksFinance The Bank of Kyoto, Ltd. engages in the provision of financial services. It operates through the Banking Business and Others segments. The Banking Business segment includes deposits and loans services, trading securities, securities investment, and domestic and foreign exchange services. The Others segment includes credit guarantee, lease, and credit card businesses. The company was founded on October 1, 1941 and is headquartered in Kyoto, Japan. | Corporate Officer/Principal | - |
TOWA CORPORATION | Präsident | 29.05.2012 |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
Börsennotierte Unternehmen | 1 |
---|---|
TOWA CORPORATION | Producer Manufacturing |
Private Unternehmen | 2 |
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The Bank of Kyoto, Ltd.
The Bank of Kyoto, Ltd. Major BanksFinance The Bank of Kyoto, Ltd. engages in the provision of financial services. It operates through the Banking Business and Others segments. The Banking Business segment includes deposits and loans services, trading securities, securities investment, and domestic and foreign exchange services. The Others segment includes credit guarantee, lease, and credit card businesses. The company was founded on October 1, 1941 and is headquartered in Kyoto, Japan. | Finance |
Bandick Corp.
Bandick Corp. Miscellaneous ManufacturingProducer Manufacturing Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life. | Producer Manufacturing |