Daniel L. Donabedian

Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC.

Tessera Technologies, Inc. develops and licenses innovative semiconductor, interconnect and imaging technologies. The company offers mobile computing and communications, memory and data storage and 3-D Integrated Circuit technologies. Tessera Technologies was founded in 1990 and is headquartered in San Jose, CA.

Elpida Memory, Inc. manufactures Dynamic Random Access Memory (DRAM) integrated circuits. The company provides DRAM solutions across a wide range of applications, including personal computers, servers, mobile devices and digital consumer electronics. Its products include DDR3 SDRAM, Mobile RAM, GDDR and XDR DRAM. The company was founded on December 20, 1999 and is headquartered in Tokyo, Japan.