Chun Yi Hsu
Direktor/Vorstandsmitglied bei SENSORTEK TECHNOLOGY CORP.
Aktive Positionen von Chun Yi Hsu
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| SENSORTEK TECHNOLOGY CORP. | Direktor/Vorstandsmitglied | 21.05.2019 | - |
| Independent Dir/Board Member | 21.05.2019 | - | |
| United Capital Management Ltd. | Direktor/Vorstandsmitglied | 05.04.2010 | - |
Karriereverlauf von Chun Yi Hsu
Ehemalige bekannte Positionen von Chun Yi Hsu
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| CHIPSIP TECHNOLOGY CO LTD | Direktor/Vorstandsmitglied | 19.06.2009 | - |
| Independent Dir/Board Member | 19.06.2009 | - | |
| TONG HSING ELECTRONIC INDUSTRIES, LTD. | Direktor/Vorstandsmitglied | 09.07.2007 | - |
| SANDMARTIN INTERNATIONAL HOLDINGS LIMITED | Direktor/Vorstandsmitglied | 05.04.2010 | - |
| Independent Dir/Board Member | 08.09.2011 | - |
Ausbildung von Chun Yi Hsu
| Tunghai University | Undergraduate Degree |
| China Europe International Business School | Masters Business Admin |
| The University of Texas at Dallas | Graduate Degree |
| The University of Texas at Austin | Masters Business Admin |
Statistik
International
| Taiwan | 6 |
| Vereinigte Staaten | 3 |
| Hong Kong | 2 |
Operativ
| Director/Board Member | 5 |
| Independent Dir/Board Member | 3 |
| Masters Business Admin | 2 |
Sektoral
| Electronic Technology | 5 |
| Consumer Services | 5 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
| Börsennotierte Unternehmen | 3 |
|---|---|
| SANDMARTIN INTERNATIONAL HOLDINGS LIMITED | Electronic Technology |
| TONG HSING ELECTRONIC INDUSTRIES, LTD. | Electronic Technology |
| SENSORTEK TECHNOLOGY CORP. | Electronic Technology |
| Private Unternehmen | 2 |
|---|---|
| United Capital Management Ltd. | |
ChipSiP Technology Co. Ltd.
 ChipSiP Technology Co. Ltd. SemiconductorsElectronic Technology ChipSiP Technology Co. Ltd. engages in the manufacture and sale of system in package and multi-chips package miniaturization solutions. It operates through the following business divisions: Logic SiP, RF SiP, and SiP Turnkey. The Logic SiP division provides integrated memory solutions, hardware, and software integrated resources. The RF SiP division offers wireless functions of wifi, bluetooth, GPS, zigbee and wimax. The SiP Turnkey division provides know-how of integration from digital camera, camcorder, mobile phone and tablet PC. The company was founded on July 29, 2002 and is headquartered in Taipei, Taiwan. | Electronic Technology |
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