Chun Yi Hsu
Director/Board Member bei SENSORTEK TECHNOLOGY CORP.
Profil
Chun Yi Hsu is currently an Executive Director at United Capital Management Ltd.
and an Independent Director at Sensortek Technology Corp.
He previously worked as a Non-Executive Director at Sandmartin International Holdings Ltd., an Independent Director at ChipSiP Technology Co. Ltd., and a Member-Supervisory Board at Tong Hsing Electronics Industries Ltd.
Mr. Hsu holds an MBA from The University of Texas at Austin and China Europe International Business School, a graduate degree from The University of Texas at Dallas, and an undergraduate degree from Tunghai University.
Aktive Positionen von Chun Yi Hsu
| Unternehmen | Position | Beginn |
|---|---|---|
| SENSORTEK TECHNOLOGY CORP. | Director/Board Member | 21.05.2019 |
| United Capital Management Ltd. | Director/Board Member | 05.04.2010 |
Ehemalige bekannte Positionen von Chun Yi Hsu
| Unternehmen | Position | Ende |
|---|---|---|
| CHIPSIP TECHNOLOGY CO LTD | Director/Board Member | - |
| TONG HSING ELECTRONIC INDUSTRIES, LTD. | Director/Board Member | - |
| SANDMARTIN INTERNATIONAL HOLDINGS LIMITED | Director/Board Member | - |
Ausbildung von Chun Yi Hsu
| The University of Texas at Austin | Masters Business Admin |
| The University of Texas at Dallas | Graduate Degree |
| China Europe International Business School | Masters Business Admin |
| Tunghai University | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Börsennotierte Unternehmen | 3 |
|---|---|
| SANDMARTIN INTERNATIONAL HOLDINGS LIMITED | Electronic Technology |
| TONG HSING ELECTRONIC INDUSTRIES, LTD. | Electronic Technology |
| SENSORTEK TECHNOLOGY CORP. | Electronic Technology |
| Private Unternehmen | 2 |
|---|---|
ChipSiP Technology Co. Ltd.
 ChipSiP Technology Co. Ltd. SemiconductorsElectronic Technology ChipSiP Technology Co. Ltd. engages in the manufacture and sale of system in package and multi-chips package miniaturization solutions. It operates through the following business divisions: Logic SiP, RF SiP, and SiP Turnkey. The Logic SiP division provides integrated memory solutions, hardware, and software integrated resources. The RF SiP division offers wireless functions of wifi, bluetooth, GPS, zigbee and wimax. The SiP Turnkey division provides know-how of integration from digital camera, camcorder, mobile phone and tablet PC. The company was founded on July 29, 2002 and is headquartered in Taipei, Taiwan. | Electronic Technology |
| United Capital Management Ltd. |
