Ursprung des Netzwerks ersten Grades von Marcus Crayon
| Einheit | Art der Einheit | Industrie | |
|---|---|---|---|
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
4
| Subsidiary | Semiconductors | 4 |
Unternehmensgrafik - zweiten Grades
Beziehungen zu mehreren Unternehmen
Unternehmensverbindungen über das persönliche Netzwerk von Marcus Crayon
| Unternehmen | Sektor | Verknüpfte Personen | Hauptposition |
|---|---|---|---|
| SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President | |
| FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal |
Statistik
International
| Vereinigte Staaten | 4 |
Sektoral
| Utilities | 2 |
| Electronic Technology | 2 |
| Technology Services | 2 |
Operativ
| Sales & Marketing | 2 |
| President | 2 |
| Corporate Officer/Principal | 2 |
| Director of Finance/CFO | 1 |
| Chief Operating Officer | 1 |
Am stärksten vernetzte Beziehungen
| Insiders | |
|---|---|
| Jay B. Grover | 4 |
| Fred Hickman | 1 |
| David McComb | 1 |
| Greg Marshall | 1 |
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