Jay B. Grover
Keine laufenden Positionen mehr
Profil
Jay B.
Grover worked as a Senior Director-Global Logistics at SunEdison, Inc. from 2010 to 2017.
Prior to that, he was the Chief Operations Officer at FlipChip International LLC from 2005 to 2010 and the President at AGC Multi Material America, Inc. from 1997 to 2005.
He also worked as the Vice President-Supply Chain at FTC Solar, Inc. from 2019 to 2021.
Ehemalige bekannte Positionen von Jay B. Grover
| Unternehmen | Position | Ende |
|---|---|---|
| FTC SOLAR, INC. | Corporate Officer/Principal | 27.08.2021 |
| SUNEDISON INC | Corporate Officer/Principal | 01.01.2017 |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Geschäftsführer | 01.01.2010 |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Präsident | 01.01.2005 |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Börsennotierte Unternehmen | 1 |
|---|---|
| FTC SOLAR, INC. | Technology Services |
| Private Unternehmen | 3 |
|---|---|
SunEdison, Inc.
 SunEdison, Inc. Alternative Power GenerationUtilities SunEdison, Inc. engages in the provision of renewable-energy services. The company was founded on August 6, 1959 and is headquartered in Maryland Beltsville, MD. | Utilities |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
