Hsiu-Ying Chiu
Corporate Officer/Principal bei SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD.
Aktive Positionen von Hsiu-Ying Chiu
Unternehmen | Position | Beginn | Ende |
---|---|---|---|
SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Corporate Officer/Principal | 22.09.2022 | - |
Vorsitzender | 25.07.2015 | 22.09.2022 |
Karriereverlauf von Hsiu-Ying Chiu
Ehemalige bekannte Positionen von Hsiu-Ying Chiu
Unternehmen | Position | Beginn | Ende |
---|---|---|---|
TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Direktor/Vorstandsmitglied | 29.04.2013 | 17.12.2018 |
CHUNG HWA PULP CORPORATION | Direktor/Vorstandsmitglied | 08.09.2010 | - |
BOARDTEK ELECTRONICS CORP | Direktor/Vorstandsmitglied | 08.09.2010 | - |
YFY INC. | Direktor/Vorstandsmitglied | 23.06.2006 | - |
Vorsitzender | 23.06.2006 | - | |
Finanzdirektor/CFO | 23.06.2006 | - |
Ausbildung von Hsiu-Ying Chiu
University of Pittsburgh | Doctorate Degree |
Carnegie Mellon University | Doctorate Degree |
National Taiwan University | Doctorate Degree |
Statistik
International
Taiwan | 6 |
Vereinigte Staaten | 3 |
Cayman Islands | 2 |
Operativ
Director/Board Member | 4 |
Doctorate Degree | 3 |
Chairman | 2 |
Sektoral
Process Industries | 4 |
Consumer Services | 4 |
Electronic Technology | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
Börsennotierte Unternehmen | 4 |
---|---|
YFY INC. | Process Industries |
CHUNG HWA PULP CORPORATION | Process Industries |
TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Health Technology |
SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Process Industries |
Private Unternehmen | 1 |
---|---|
BoardTek Electronics Corp.
BoardTek Electronics Corp. Electronic ComponentsElectronic Technology BoardTek Electronics Corp. engages in the design, manufacture, and sale of multilayer PCB, single & double-sided PCB, and electronic components. Its products include PCB products, integrated circuit (IC) substrate, and green process and system integration. The PCB products cover high speed digital PCB, high frequency microwave PCB, pre-bond metal PCB, post-bonding metal PCB, coin insertion and embedding, ceramic substrate embedded PCB, and heavy copper PCB. The IC substrate covers flash and memory card substrate, complementary metal-oxide semiconductor (CMOS) image sensor substrate, and light-emitting diode (LED) Substrate. The green process and system integration covers high purity copper oxide, copper concentration control system, and insoluble anode. BoardTek Electronics was founded on June 8, 1987 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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