Chia Hsing Lin
Direktor/Vorstandsmitglied bei WALTON ADVANCED ENGINEERING, INC.
Aktive Positionen von Chia Hsing Lin
| Unternehmen | Position | Beginn | Ende |
|---|---|---|---|
| WALTON ADVANCED ENGINEERING, INC. | Direktor/Vorstandsmitglied | 25.06.2013 | - |
| ZIMMITE TAIWAN LTD. | Direktor/Vorstandsmitglied | - | - |
| Independent Dir/Board Member | - | - | |
| KINGPAK TECHNOLOGY INC. | Direktor/Vorstandsmitglied | - | - |
| Independent Dir/Board Member | - | - |
Karriereverlauf von Chia Hsing Lin
Ausbildung von Chia Hsing Lin
| Tatung University | Undergraduate Degree |
| National Taiwan University | Masters Business Admin |
Statistik
International
| Taiwan | 6 |
Operativ
| Director/Board Member | 3 |
| Independent Dir/Board Member | 2 |
| Undergraduate Degree | 1 |
Sektoral
| Consumer Services | 3 |
| Electronic Technology | 3 |
| Utilities | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
| Börsennotierte Unternehmen | 2 |
|---|---|
| WALTON ADVANCED ENGINEERING, INC. | Electronic Technology |
| ZIMMITE TAIWAN LTD. | Utilities |
| Private Unternehmen | 1 |
|---|---|
Kingpak Technology, Inc.
 Kingpak Technology, Inc. SemiconductorsElectronic Technology Kingpak Technology, Inc. engages in the testing and sale of complementary metal-oxide semiconductor (CMOS) image sensor, CMOS image sensors (CIS) and integrated circuit packaging. It mainly focuses on consumer products, wearable products, safety monitoring & automobile related CIS packaging as well as video testing services. The company's products include CMOS image sensor, micro-electro-mechanical systems (MEMS), ball grid array (BGA), and system in package (SiP). Kingpak Technology was founded on May 8, 1991 and is headquartered in Taipei, Taiwan. | Electronic Technology |
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