Kao Hsun Chang
President bei KING YUAN ELECTRONICS CO., LTD.
Vermögen: 10 Mio $ am 31.03.2024
Profil
Kao Hsun Chang is currently the Chairman at KYEC Japan KK, Director at KYEC USA Corp., Director at KYEC Singapore Pte Ltd., Director at Zhen Kun Technology Co., Ltd., Director at Suzhou Zhen Kun Technology Ltd., General Manager at King Yuan Electronics Co., Ltd.
(starting in 2000), and Member-Supervisory Board at Jinglong Technology (Suzhou) Co. Ltd.
Mr. Chang previously worked as a Manager at Winbond Electronics Corp.
Mr. Chang holds an MBA from Saginaw Valley State University (Michigan) and an undergraduate degree from National Cheng Kung University.
Bekannte Unternehmensbeteiligungen
| Unternehmen | Datum | Anzahl der Aktien | Bewertung | Datum der Bewertung |
|---|---|---|---|---|
| 31.01.2024 | 3 051 294 ( 0,25% ) | 10 Mio $ | 31.03.2024 |
Aktive Positionen von Kao Hsun Chang
| Unternehmen | Position | Beginn |
|---|---|---|
| KING YUAN ELECTRONICS CO., LTD. | President | 01.09.2023 |
| KYEC USA Corp. | Director/Board Member | - |
| KYEC Singapore Pte Ltd. | Director/Board Member | - |
| KYEC Japan KK | Chairman | - |
Jinglong Technology (Suzhou) Co. Ltd.
 Jinglong Technology (Suzhou) Co. Ltd. SemiconductorsElectronic Technology Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China. | Director/Board Member | - |
| Zhen Kun Technology Co., Ltd. | Director/Board Member | - |
Suzhou Zhen Kun Technology Ltd.
 Suzhou Zhen Kun Technology Ltd. Electronic ComponentsElectronic Technology Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China. | Director/Board Member | - |
Ehemalige bekannte Positionen von Kao Hsun Chang
| Unternehmen | Position | Ende |
|---|---|---|
| WINBOND ELECTRONICS CORPORATION | Corporate Officer/Principal | - |
Ausbildung von Kao Hsun Chang
| Saginaw Valley State University (Michigan) | Masters Business Admin |
| National Cheng Kung University | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Börsennotierte Unternehmen | 2 |
|---|---|
| WINBOND ELECTRONICS CORPORATION | Electronic Technology |
| KING YUAN ELECTRONICS CO., LTD. | Commercial Services |
| Private Unternehmen | 6 |
|---|---|
| KYEC USA Corp. | |
Jinglong Technology (Suzhou) Co. Ltd.
Jinglong Technology (Suzhou) Co. Ltd. SemiconductorsElectronic Technology Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China. | Electronic Technology |
| KYEC Japan KK | |
| KYEC Singapore Pte Ltd. | |
| Zhen Kun Technology Co., Ltd. | |
Suzhou Zhen Kun Technology Ltd.
Suzhou Zhen Kun Technology Ltd. Electronic ComponentsElectronic Technology Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China. | Electronic Technology |
