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G. William Knapp
Keine laufenden Positionen mehr
Karriereverlauf von G. William Knapp
Ehemalige bekannte Positionen von G. William Knapp
Unternehmen | Position | Beginn | Ende |
---|---|---|---|
Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Corporate Officer/Principal | - | - |
Ausbildung von G. William Knapp
North Carolina State University | Graduate Degree |
University of Cincinnati (Ohio) | Undergraduate Degree |
Statistik
International
Vereinigte Staaten | 4 |
Operativ
Corporate Officer/Principal | 1 |
Graduate Degree | 1 |
Undergraduate Degree | 1 |
Sektoral
Consumer Services | 3 |
Electronic Technology | 2 |
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Unternehmensverbindungen
Private Unternehmen | 1 |
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Invensas Bonding Technologies, Inc.
![]() Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Invensas Bonding Technologies, Inc. is a holding company, which engages in the design and development of semiconductor integration technology. It helps lower manufacturing and packaging costs and as well as increase yield associated with the manufacturing of Backside Illuminated (BSI) CMOS image sensors (IS), high-speed logic, stacked memory and memory-on-processor. Its technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level by delivering advantages including: reduced silicon cost, size reduction, reduced NRE, shorter time-to-market, lower power consumption, and increased system speed and performance. The company was founded in October 2000 and is headquartered in Raleigh, NC. | Electronic Technology |
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