Brian W. Barber
Keine laufenden Positionen mehr
Profil
Brian W.
Barber worked as a Vice President & Manager-Business Unit at Hadco Corp.
from 1982 to 1999.
He then worked as a Senior Vice President-Global Operations at Viasystems, Inc. from 2007 to 2015.
In 2020, he briefly worked as an Executive VP-Operations Special Projects at TTM Technologies, Inc. Prior to these roles, he was a Vice President at Stuart Olson, Inc. and a Senior Vice President-Hi Technology Division at Viasystems Group, Inc. Mr. Barber obtained an undergraduate degree from the State University of New York at Binghamton.
Ehemalige bekannte Positionen von Brian W. Barber
| Unternehmen | Position | Ende |
|---|---|---|
| TTM TECHNOLOGIES, INC. | Geschäftsführer | 01.01.2020 |
| VIASYSTEMS GROUP, INC. | Corporate Officer/Principal | 01.05.2015 |
Viasystems, Inc.
 Viasystems, Inc. Electronic ComponentsElectronic Technology Viasystems, Inc. engages in the provision of complex multi-layer printed circuit boards and electro-mechanical solutions. It operates under the Printed Circuit Boards and Assembly segments. The Printed Circuit Boards segment focuses on printed circuit board manufacturing facilities located in China. The Assembly segment is involved in assembly operations including back panel assembly, printed circuit board assembly, cable assembly, custom enclosures, and full system assembly and testing. The company was founded on April 2, 1997 and is headquartered in St. Louis, MO. | Corporate Officer/Principal | 01.05.2015 |
Hadco Corp.
 Hadco Corp. Electrical ProductsProducer Manufacturing Hadco Corp. was engaged in manufacturing printed circuits. The company was founded by Howard A. Daum in 1953 and was headquartered in Salem, NH. | Corporate Officer/Principal | 01.12.1999 |
| STUART OLSON INC. | Corporate Officer/Principal | - |
Ausbildung von Brian W. Barber
| State University of New York at Binghamton | Undergraduate Degree |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Börsennotierte Unternehmen | 1 |
|---|---|
| TTM TECHNOLOGIES, INC. | Electronic Technology |
| Private Unternehmen | 4 |
|---|---|
Viasystems Group, Inc.
 Viasystems Group, Inc. Electronic ComponentsElectronic Technology Viasystems Group, Inc. engages in the provision of complex multi-layer printed circuit boards and electro-mechanical solutions. The company was founded on 1996 and is headquartered in Costa Mesa, CA. | Electronic Technology |
Viasystems, Inc.
Viasystems, Inc. Electronic ComponentsElectronic Technology Viasystems, Inc. engages in the provision of complex multi-layer printed circuit boards and electro-mechanical solutions. It operates under the Printed Circuit Boards and Assembly segments. The Printed Circuit Boards segment focuses on printed circuit board manufacturing facilities located in China. The Assembly segment is involved in assembly operations including back panel assembly, printed circuit board assembly, cable assembly, custom enclosures, and full system assembly and testing. The company was founded on April 2, 1997 and is headquartered in St. Louis, MO. | Electronic Technology |
Stuart Olson, Inc.
 Stuart Olson, Inc. Engineering & ConstructionIndustrial Services Stuart Olson, Inc. engages in the provision of construction and industrial services. The firm also provides general contracting and electrical building systems contracting in the institutional and commercial construction markets. It operates through the following segments: Industrial Group, Buildings Group, Commercial Systems Group and Corporate Group. The company was founded on August 31, 1981 and is headquartered in Calgary, Canada. | Industrial Services |
Hadco Corp.
Hadco Corp. Electrical ProductsProducer Manufacturing Hadco Corp. was engaged in manufacturing printed circuits. The company was founded by Howard A. Daum in 1953 and was headquartered in Salem, NH. | Producer Manufacturing |
