Sandro Pampel
Vorstandsvorsitzender bei First Sensor Microelectronic Packaging GmbH
Profil
Sandro Pampel is currently a Co-Chief Executive Officer at First Sensor Microelectronic Packaging GmbH.
Aktive Positionen von Sandro Pampel
| Unternehmen | Position | Beginn |
|---|---|---|
First Sensor Microelectronic Packaging GmbH
 First Sensor Microelectronic Packaging GmbH Industrial SpecialtiesProcess Industries Part of TE Connectivity Ltd., First Sensor Microelectronic Packaging GmbH develops and produces customer-specific microelectronic packaging and module solutions. The company is based in Dresden, Germany. First Sensor Microelectronic Packaging was acquired by First Sensor AG from Zentrum Mikroelektronik Dresden AG on September 19, 2005. The CEOs of the German company are Matthias Peschke, Sandro Pampel. | Vorstandsvorsitzender | - |
Erfahrungen
Besetzte Positionen
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Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
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Unternehmensverbindungen
| Private Unternehmen | 1 |
|---|---|
First Sensor Microelectronic Packaging GmbH
First Sensor Microelectronic Packaging GmbH Industrial SpecialtiesProcess Industries Part of TE Connectivity Ltd., First Sensor Microelectronic Packaging GmbH develops and produces customer-specific microelectronic packaging and module solutions. The company is based in Dresden, Germany. First Sensor Microelectronic Packaging was acquired by First Sensor AG from Zentrum Mikroelektronik Dresden AG on September 19, 2005. The CEOs of the German company are Matthias Peschke, Sandro Pampel. | Process Industries |
