Janine Schmitz
Vertrieb & Marketing bei FlipChip International LLC
Ursprung des Netzwerks ersten Grades von Janine Schmitz
Einheit | Art der Einheit | Industrie | |
---|---|---|---|
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
5
| Subsidiary | Semiconductors | 5 |
Unternehmensgrafik - zweiten Grades
Beziehungen zu mehreren Unternehmen
Unternehmensverbindungen über das persönliche Netzwerk von Janine Schmitz
Unternehmen | Sektor | Verknüpfte Personen | Hauptposition |
---|---|---|---|
EZCONN CORPORATION | Electronic Components | Chairman | |
SHC Consolidated Investors LLC | Chairman | ||
eGTran Corp.
eGTran Corp. SemiconductorsElectronic Technology eGTran Corp. designs and supplies high-performance broadband connectivity products. The company’s products are used throughout the long haul, metro and access networks, across cable, satellite, telecommunications, data-communications and wireless communications networks. It serves multimedia wireless and fiber optic communication technology industries. eGTran was founded by Frank S. Lee in September 2006 and is headquartered in Taipei, Taiwan. | Semiconductors | Chairman | |
Spatial Digital Systems, Inc. | Director/Board Member | ||
Trimax & Cos. Llc | Chairman | ||
Stembios Technologies, Inc. | Director/Board Member | ||
SERCOMM CORPORATION | Telecommunications Equipment | Director/Board Member | |
Harvard Law School | College/University | Graduate Degree | |
Dna Asset Management LLC | Chairman | ||
UNISEM (M) | Semiconductors | Director/Board Member | |
Fudan University | College/University | Doctorate Degree | |
Adelphi University | College/University | Masters Business Admin | |
Huatian Technology (Kunshan) Electronics Co. Ltd.
Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Electronic Production Equipment | Chief Executive Officer | |
Xiamen Yonghong Group Co. Ltd.
Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Semiconductors | Corporate Officer/Principal | |
Unisem Advanced Technologies Sdn. Bhd.
Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Semiconductors | Director/Board Member | |
TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Semiconductors | Director/Board Member |
Statistik
International
Vereinigte Staaten | 8 |
China | 5 |
Taiwan | 4 |
Malaysia | 3 |
Sektoral
Electronic Technology | 9 |
Consumer Services | 4 |
Operativ
Director/Board Member | 8 |
Chairman | 5 |
Corporate Officer/Principal | 2 |
President | 1 |
Sales & Marketing | 1 |
Am stärksten vernetzte Beziehungen
Insiders | |
---|---|
Steve K. Chen | 10 |
Zhi Yi Xiao | 8 |
David McComb | 1 |
Bruce Bowers | 1 |
Dawn Cuevas | 1 |
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