Chih-Ming Lai
Chief Executive Officer bei Jiangyin Changdian Advanced Packaging Co., Ltd.
Profil
Chih-Ming Lai is currently the Chief Executive Officer of Jiangyin Changdian Advanced Packaging Co., Ltd.
He previously served as the Chief Executive Officer & Executive Director of STATS ChipPAC Pte Ltd.
from 2017 to 2018 and as a Non-Executive Non-Independent Director from 2015 to 2017.
He also held the position of Executive Vice President at JCET Group Co., Ltd.
Aktive Positionen von Chih-Ming Lai
| Unternehmen | Position | Beginn |
|---|---|---|
Jiangyin Changdian Advanced Packaging Co., Ltd.
 Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Part of JCET Group Co., Ltd., Jiangyin Changdian Advanced Packaging Co., Ltd. is a private company that manufactures and develops semiconductor chip and related products. The company is based in Jiangyin, China. The CEO of the Chinese company is Chih-Ming Lai. | Chief Executive Officer | - |
Ehemalige bekannte Positionen von Chih-Ming Lai
| Unternehmen | Position | Ende |
|---|---|---|
| STATS CHIPPAC LTD. | Chief Executive Officer | 27.09.2018 |
| STATS CHIPPAC LTD. | Director/Board Member | 22.02.2017 |
| JCET GROUP CO., LTD. | Corporate Officer/Principal | - |
Erfahrungen
Besetzte Positionen
Aktive
Inaktive
Börsennotierte Unternehmen
Private Unternehmen
Beziehungen
Beziehungen ersten Grades
Unternehmen ersten Grades
Herr
Frau
Aufsichtsräte
Führungskräfte
Unternehmensverbindungen
| Börsennotierte Unternehmen | 1 |
|---|---|
| JCET GROUP CO., LTD. | Electronic Technology |
| Private Unternehmen | 2 |
|---|---|
STATS ChipPAC Pte Ltd.
 STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology STATS ChipPAC Pte Ltd. engages in the provision of semiconductor test and packaging services. Its services includes design, characterization, and wafer bumping.The company was founded by June Lihan Chia in 1994 and is headquartered in Singapore. | Electronic Technology |
Jiangyin Changdian Advanced Packaging Co., Ltd.
Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Part of JCET Group Co., Ltd., Jiangyin Changdian Advanced Packaging Co., Ltd. is a private company that manufactures and develops semiconductor chip and related products. The company is based in Jiangyin, China. The CEO of the Chinese company is Chih-Ming Lai. | Electronic Technology |
